Browsing by Subject Au/Ni(P)/Cu substrate
Showing results 1 to 1 of 1
| Issue Date | Title | Author(s) |
|---|---|---|
| Apr-2005 | Effect of aging on the interfacial reactions of BGA Sn-Ag-Cu and Sn-Ag solders with Ni(P) / Au surface finish on Cu pad | Sharif, Ahmed; Chan, Y. C. |