Browsing "Student Works With External Awards (2001 - July 2017)" by Subject Sn based lead-free solder
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Issue Date | Title | Author(s) |
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Apr-2005 | Effect of aging on the interfacial reactions of BGA Sn-Ag-Cu and Sn-Ag solders with Ni(P) / Au surface finish on Cu pad | Sharif, Ahmed; Chan, Y. C. |
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