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Issue DateTitleAuthor(s)
Apr-2005Effect of aging on the interfacial reactions of BGA Sn-Ag-Cu and Sn-Ag solders with Ni(P) / Au surface finish on Cu padSharif, Ahmed; Chan, Y. C.

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Author
  • 1 Sharif, Ahmed
Subject
  • 1 Intermetallic compounds
  • 1 Ni(P) consumption
Date issued
  • 1 2005
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