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Please use this identifier to cite or link to this item: http://hdl.handle.net/2031/4994

Title: Process modification and reliability study of nonconductive adhesive flip chip assembly for smart card application
Other Titles: Ying yong yu zhi neng ka zhi dao zhuang xin pian fei dao dian xing bo mo feng zhuang de gong yi gai jin yu ke kao xing yan jiu
應用于智能卡之倒裝芯片非導電性薄膜封裝的工藝改進與可靠性研究
Authors: Ma, Ying (馬穎)
Department: Dept. of Electronic Engineering
Degree: Master of Philosophy
Issue Date: 2007
Publisher: City University of Hong Kong
Subjects: Flip chip technology
Smart cards
Notes: CityU Call Number: TK7895.S62 M3 2007
Includes bibliographical references (leaves 94-101)
Thesis (M.Phil.)--City University of Hong Kong, 2007
xiii, 102 leaves : ill. ; 30 cm.
Type: Thesis
Abstract: Adhesive flip chip interconnection technology is known as one alternative solution to solder interconnection technology. Advantages offered include cost reduction, manufacturing simplicity, a fine pitch possibility, good electrical performance, as well as environmental friendliness. Among the different types of adhesives, nonconductive adhesive (NCA) enables an ultra-fine pitch feasibility due to the absence of conductive particles in the adhesive matrix. NCA flip chip technology has recently found some applications, such as in LED array modules, millimeter-wave ICs, and memory cards. However, in some cases when low cost substrates are used to reduce the total production cost, the intrinsic limitations of the substrate material puts forward further demands on the modification of the assembly process. Also, reliability issues of the assemblies need to be re-investigated after the process revision. In this study, the effects of key parameters in the adhesive flip chip assembly process were systematically studied through a variety of thermal analysis techniques as well as from electrical and mechanical characterization results. Test samples were assembled following a serious of potential assembly schemes in which the NCAs underwent different curing profiles. Reliability tests were performed to assess the performance of the adhesive interconnections stressed in high temperature and high humidity environments, and to investigate the feasibility of the proposed process modification. Failure analysis was conducted to gain more insight into the failure causes in order to further refine the assembly process after a related failure mechanism was elucidated. To conclude, the NCA flip chip assembly process was modified and key parameters were adjusted in this study to enable the use of a low cost substrate, while the quality and reliability of the NCA flip chip assemblies were ensured. One optimal assembly scheme was presented and the contactless smart card samples using a low cost poly(ethylene terephthalate) substrate were fabricated. It is expected that this study will provide usable information related to smart card production and other similar processes such as radiofrequency identification smart label fabrication, etc.
Online Catalog Link: http://lib.cityu.edu.hk/record=b2217886
Appears in Collections:EE - Master of Philosophy

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