Multiway Substrate Integrated Waveguide Power Divider

Abstract

Power dividers have been commonly applied in microwave communication systems. The development of these systems requires low-cost, low-loss and compact component application. However, difficult, expensive manufacturing of conventional waveguide structure has become an obstruction for low-cost applications. Substrate integrated waveguide (SIW) has appeared as an attractive planar integration scheme which can provide more convenient fabrication. The project aims to develop a substrate integrated waveguide radial cavity power divider that can achieve low-loss, low-cost and high-density integration. In this study, a four-way power divider operating at X-band was analyzed and designed, especially for its probe structure and radial cavity. In addition, the SIW radial cavity was built by standard printed circuit board (PCB) process. The SIW power divider has advantages of low cost and low loss, and can be easily integrated.