Development of fiber-buried optical printed circuit boards

Abstract

With the advancement of technology, the speed of the processor has increased a lot. However, due to the skin effect, electric power with high data rate cannot travel far in the PCBs (Printed Circuit Boards). In order to achieve high data rate transmission in the PCBs, using optical fiber instead of copper wire would be a better choice. The report describes the manufacturing process of 12 multimode fibers glass MT connectors that can withstand high temperature and pressure during the lamination process. On top of that, the report records demonstrations under different OPCBs (Optical Printed Circuit Boards) lamination conditions, such as male to male OPCB, female to female OPCB and flexible designed fiber route OPCB. Each demonstration recorded power loss, problem faced, advantages and disadvantages. The final objective is to make OPCBs with flexible route of buried low loss fibers.