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Browsing by Author Chan, Y. C.
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Showing results 1 to 2 of 2
Issue Date
Title
Author(s)
Apr-2005
Effect of aging on the interfacial reactions of BGA Sn-Ag-Cu and Sn-Ag solders with Ni(P) / Au surface finish on Cu pad
Sharif, Ahmed
;
Chan, Y. C.
Aug-2014
Electroless Ni-P-ZrO2 metallization for lead-free solder interconnection
Hu, Xiao (胡驍)
;
Chan, Y. C.
