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Issue DateTitleAuthor(s)
Apr-2005Effect of aging on the interfacial reactions of BGA Sn-Ag-Cu and Sn-Ag solders with Ni(P) / Au surface finish on Cu padSharif, Ahmed; Chan, Y. C.
Aug-2014Electroless Ni-P-ZrO2 metallization for lead-free solder interconnectionHu, Xiao (胡驍); Chan, Y. C.

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Author
  • 1 Hu, Xiao (胡驍)
  • 1 Sharif, Ahmed
Subject
  • 1 Au/Ni(P)/Cu substrate
  • 1 Intermetallic compounds
  • 1 Ni(P) consumption
  • 1 Sn based lead-free solder
Date issued
  • 1 2005
  • 1 2014
Has File(s)
  • 2 true
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