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Issue Date
Title
Author(s)
Apr-2005
Effect of aging on the interfacial reactions of BGA Sn-Ag-Cu and Sn-Ag solders with Ni(P) / Au surface finish on Cu pad
Sharif, Ahmed
;
Chan, Y. C.
Aug-2014
Electroless Ni-P-ZrO2 metallization for lead-free solder interconnection
Hu, Xiao (胡驍)
;
Chan, Y. C.
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Author
1
Hu, Xiao (胡驍)
1
Sharif, Ahmed
Subject
1
Au/Ni(P)/Cu substrate
1
Intermetallic compounds
1
Ni(P) consumption
1
Sn based lead-free solder
Date issued
1
2005
1
2014
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2
true