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CityU Institutional Repository >
Browsing by Title
| Issue Date | Title | Author(s) | | 2008 | Study on components for RF MIMO | Zheng, Shaoyong (鄭少勇) |
| 2012 | Study on doping of boron nitride films | Ye, Qing (葉青) |
| 2007 | A study on efficient chaotic image encryption schemes | Kwok, Sin Hung (郭善雄) |
| 2010 | Study on failure spreading and virus propagation using complex network models | Fan, Wei (范煒) |
| 2012 | A study on fast plagiarism checking algorithm-I | Li, Shiyin |
| 2012 | A study on fast plagiarism checking algorithm - II | Liang, Qihui |
| 2008 | Study on Hong Kong housing market efficiency and housing price dynamics model under the condition of boundedly rational expectations | Xu, Jiana (徐佳娜) |
| 2007 | A study on human pre-movement behavior under emergencies using system dynamics approach | Zhao, Chunmei (趙春梅) |
| 2005 | Study on innovative integrated power amplifier/low noise amplifier/switch for wireless application | Lee, Tze Kiu (李子翹) |
| 2005 | A study on interfacial interaction behavior between lead-free solders and electroless Nickel metallization for advanced electronic packaging | Sharif, Ahmed |
| 2008 | A study on international technology transfer critical factors in Hong Kong/Pearl River Delta manufacturing industries | Dong, Qiuling (董秋玲) |
| 2012 | A study on IPv6 address lookup | Tong, Hoi Kwan |
| 2004 | A study on linking consumer satisfaction to profits | He, Yanqun (何雁群) |
| 2012 | Study on manipulation of coupling and its applications in bandpass filter design | Li, Yuanchun (李園春) |
| 2011 | A study on mechanical characteristics of nanotubes based on new nonlocal elasticity models | Yang, Yang ( 楊洋) |
| 2008 | A study on models for credit scoring with support vector machines | Zhou, Ligang (周立剛) |
| 2005 | Study on non-conducting adhesives onto application of fine pitch flip chip interconnection | Tan, Sai Choo (陳帥諸) |
| 2013 | The study on operational risk of Chinese commercial bank | Wang, Yang (王洋) |
| 2006 | A study on reliability of anisotropic conductive joints under thermally induced warpage for advanced packaging | Liyakathali Khan, Lafir Ali |
| 2008 | Study on reliability of flip chip solder interconnects for high current density packaging | Yang, Dan (楊丹) |
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